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TME can perform the variety of engineering work needed to design and produce advanced technology products and custom test and
process equipment. TME has expertise in classical system, electrical, electronic, mechanical, materials, computer, and
telecom engineering disciplines. TME also has expertise in commercial product, process, component, hardware, firmware,
software, system integration, and packaging engineering.
TME can work with a variety of electronic and photonic circuitry, transmission lines, and packaging technologies. These
technologies can be used in appropriate combination to design products and to produce test and process equipment using various
TME CAD Tools.
TECHNOLOGIES
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Electronic circuits and transmission lines
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Electrical, electronic, microelectronic, RF, and microwave technologies |
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Semiconductor, hybrid, p.c. board, cable assemblies |
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Analog (low and high level, single-ended and differential, MMIC, DC-110GHz) |
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Digital (bipolar, CMOS, BiCMOS, ECL, GaAs, HBT, MMIC, etc., DC-50 Gb/s), |
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Interface (converters, sensors, transducers, drivers, actuators) |
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Power (DC, AC, switch mode) technologies |
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Photonic circuits and transmission lines
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Fiber optic (single mode, multimode, plastic or glass, 600nM-1700nM) |
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Lithium niobate, silica, and other optical integrated circuit technologies |
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Laser diodes, PIN and avalanche photodiodes, optical amplifiers and passives |
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Free space optics |
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Micro-circuit Packaging
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Discretes and hybrids (wafer saw, die mount, wire bond or flip chip, plasma clean, seal) |
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Hermetic (ceramic glass frit lead-frame, ceramic sidebraze, Kovar seam weld, epoxy seal) |
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Non-hermetic (plastic transfer mold/trim and form lead-frame, thin and thick film, encapsulation) |
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Multi-chip Modules (MCM), Chip On Board (COB), Chip On Flex (COF), and other bare die technologies |
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Microwave launchers, optical feedthrus, thermal, magnetic, EMI/RFI, stress, and ESD package design features |
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Macro-circuit Packaging
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Surface mount and through-hole p.c. board (single and multi-layer, etched or screened, integral passives) |
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Flex circuits (standard, sculpted, RF and Microwave) |
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Custom and commodity components used in discrete, integral, or integrated forms |
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Thermal, magnetic, EMI/RFI, pneumatics, and graphics package design features |
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Sheet metal, machined metal, machined plastic, wood, and related finishes |
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Die cast metal and injection molded plastic (hard and soft tooling, single and multi-cavity, short and long throw core
slides) |
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DESIGN and DEVELOPMENT
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System analysis, partitioning, and integration design
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System, electronic, electrical, mechanical, mechanical design, and component engineering
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Selection and tradeoffs for electrical, electronic, RF, microwave, mechanical, thermal,
pneumatic, acoustic, magnetic, optical, and fiber optic technologies
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Research, analysis, evaluation, and selection of materials, components, equipment, software,
and suppliers
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Evaluation, selection and design of manufacturing assembly processes, assembly fixture design,
special machine design, and test methods
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| Material procurement, assembly, and system integration for machined or tooled prototypes
| Tooling and procurement for printed circuit boards and thin and thick film hybrid substrates
| Prototype performance measurement, data analysis and interpretation, and evaluation
| Product changes, physical design revisions, production tooling, and release documentation
| Production startup, yield improvement, cost analysis, and cost reduction
| Analysis of production and customer return failures, quality, and reliability
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Last modified: 08-Feb-2009