TME can partially or fully engineer, prototype, and characterize your advanced technology product. TME can work with a wide
variety of mature and advanced electronic, photonic, and packaging technologies to create your product. TME can create
customer products at the component, assembly, equipment, and system levels.
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Hermetic and non-hermetic discrete device, Multi-Chip Modules, and hybrid assemblies
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Surface mount and through-hole printed circuit board assemblies
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Shielded and unshielded sub-assemblies, modules, equipment, and systems
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Sensors, actuators, and transducers using opto-electronics, optics, fiber optics, video, magnetic, thermal, electro-mechanics,
pneumatics, or acoustics
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Test, process, and automation equipment products
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Example products for the telecom industry include:
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Fixed and tunable lasers, PIN and avalanche optical receivers, wavelength lockers |
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Optical transmitters, receivers, transponders for 2.5 GB/s, 10 GB/s, 40 GB/s, NRZ, RZ, CRZ modulation |
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Optical amplifiers, filters, couplers, circulators, isolators, and integrated circuits |
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Data drivers, clock drivers, clock-data recovery modules |
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FEC encoders and decoders |
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DWDM and time domain multiplexers and demultiplexers |
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SONET and DSn assemblies and modules |
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Fiber span quality of service monitors |
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Last modified: 08-Feb-2009